ADAPTIVE MANUFACTURING — Modular at Every Scale

A guided dive through the ISA physical hierarchy, then plug-and-play in action

Physical
hierarchy
SITE≈ APU package
›
AREA≈ CCD-GPU-IO
›
CELL≈ Core Complex
›
UNIT≈ Core
›
EQUIP. MODULE≈ Execution Unit

Guided tour

1 · The Site — one package, many sockets
2 · The Area — a chiplet on the substrate
3 · The Process Cell — a core complex
4 · The Unit — a core & its modules
5 · Hot swap: Unit-Module releases
6 · Back to the Unit-Module pool
7 · Replacement docks & resumes
8 · One layer up: cell undocks
9 · A new cell drops in
10 · Modular at every scale

Modular at every scale

Modules swap within cells · cells swap within areas · areas swap within the site.
Standardise the interfaces, and every layer becomes plug-and-play —
the chiplet principle, applied to manufacturing.